The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 08, 2022

Filed:

Nov. 17, 2017
Applicant:

Sony Semiconductor Solutions Corporation, Kanagawa, JP;

Inventors:

Masahiro Sato, Tokyo, JP;

Machiko Kametani, Tokyo, JP;

Jun Ogi, Kanagawa, JP;

Yuri Kato, Kanagawa, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C25D 21/12 (2006.01); G01N 27/30 (2006.01); G01R 29/12 (2006.01); H03F 1/52 (2006.01); G01N 33/487 (2006.01); G01N 27/416 (2006.01);
U.S. Cl.
CPC ...
C25D 21/12 (2013.01); G01N 27/301 (2013.01); G01N 27/416 (2013.01); G01N 33/48785 (2013.01); G01R 29/12 (2013.01); H03F 1/523 (2013.01); G01N 33/48735 (2013.01);
Abstract

The present disclosure relates to a semiconductor apparatus and a potential measuring apparatus capable of preventing deterioration in signal characteristics due to parasitic capacitance caused by providing a configuration for realizing an electrode plating process when an electrode and an amplifier are provided on the same substrate. When a power source supplies a potential necessary for plating processing and a breaker reads a signal from liquid, and an amplifier amplifies and outputs the signal, the power source required for the plating processing is blocked with respect to the electrode. This is applicable to the potential measuring apparatus.


Find Patent Forward Citations

Loading…