The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 08, 2022
Filed:
Jan. 25, 2022
Applicant:
Chang Chun Petrochemical Co., Ltd., Taipei, TW;
Inventors:
Yao-Sheng Lai, Taipei, TW;
Jui-Chang Chou, Taipei, TW;
Assignee:
CHANG CHUN PETROCHEMICAL CO., LTD., Taipei, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C25D 7/04 (2006.01); C25D 1/04 (2006.01); H05K 3/14 (2006.01); C25D 5/00 (2006.01); C25D 5/12 (2006.01); C25D 7/06 (2006.01); B32B 15/01 (2006.01); B32B 15/08 (2006.01);
U.S. Cl.
CPC ...
C25D 1/04 (2013.01); B32B 15/01 (2013.01); B32B 15/08 (2013.01); C25D 5/12 (2013.01); C25D 5/605 (2020.08); C25D 7/0614 (2013.01); H05K 3/14 (2013.01); B32B 2307/30 (2013.01); B32B 2457/08 (2013.01); H05K 2203/0726 (2013.01); Y10T 428/12431 (2015.01);
Abstract
An electrodeposited copper foil includes a bulk copper foil. When a weight of the electrodeposited copper foil is increased to 105.0 wt % during a thermogravimetric analysis (TGA) performed on the electrodeposited copper foil at a heating rate of 5° C./min and an air flow rate of 95 mL/min, a heating temperature of the TGA is defined as Tand in a range of 550° C. to 750° C.