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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11492519 B1

PDFFull Text
Date of Patent:
Nov. 08, 2022

Filed:

Jun. 18, 2019

Polyimide film for semiconductor package

Applicant:

Ipi Tech Inc, Daejeon, KR;

Inventors:

Kye Ung Lee, Daejeon, KR;

Ju Hwan Chun, Daejeon, KR;

Ho Young Park, Daejeon, KR;

Tae Seok Lee, Daejeon, KR;

Assignee:

IPI TECH INC, Daejeon, KR;

Attorney:

Hauptman Ham, LLP

Primary Examiner:

Zachary M Davis

Int. Cl.
CPC ...
B32B 27/28 (2006.01); C09J 7/38 (2018.01); B32B 7/027 (2019.01); B32B 27/08 (2006.01); B32B 27/20 (2006.01); H01L 21/683 (2006.01);
U.S. Cl.
CPC ...
C09J 7/38 (2018.01); B32B 7/027 (2019.01); B32B 27/08 (2013.01); B32B 27/20 (2013.01); B32B 27/281 (2013.01); H01L 21/6836 (2013.01); B32B 2307/30 (2013.01); B32B 2457/14 (2013.01); C09J 2203/326 (2013.01); C09J 2301/208 (2020.08); C09J 2479/08 (2013.01);
Abstract

Disclosed is a semiconductor package polyimide film, which may prevent the stripping of a thermoplastic polyimide layer by reducing a difference in the average coefficient of linear thermal expansion between a substrate film and the thermoplastic polyimide layer, and may be readily detached after a reflow process is completed since the thermoplastic polyimide layer to be attached to a lead frame has a glass transition temperature less than or equal to a reflow process temperature.

Find Patent Forward Citations

Lee, Kye. (2022). Polyimide film for semiconductor package (U.S. Patent No. 11492519). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11492519

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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