The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 08, 2022

Filed:

Mar. 28, 2019
Applicant:

Jgc Catalysts and Chemicals Ltd., Kanagawa, JP;

Inventors:

Miki Egami, Fukuoka, JP;

Mitsuaki Kumazawa, Fukuoka, JP;

Ryo Muraguchi, Fukuoka, JP;

Michio Komatsu, Fukuoka, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09G 1/02 (2006.01); C09K 3/14 (2006.01); C01B 33/141 (2006.01); H01L 21/321 (2006.01); H01L 21/768 (2006.01);
U.S. Cl.
CPC ...
C09G 1/02 (2013.01); C01B 33/141 (2013.01); C09K 3/1409 (2013.01); C01P 2004/50 (2013.01); C01P 2004/61 (2013.01); C01P 2004/62 (2013.01); C01P 2004/64 (2013.01); C01P 2006/10 (2013.01); C01P 2006/12 (2013.01); C01P 2006/90 (2013.01); H01L 21/3212 (2013.01); H01L 21/7684 (2013.01);
Abstract

A polishing composition that can not only achieve high polishing speed, but also can improve the surface smoothness (surface quality) of a polished substrate and reduce defects is provided. That is, provided is a polishing composition comprising silica particles and a water soluble polymer, wherein the contained silica particles satisfy the following requirements (a) to (c): (a) the primary particle diameter based on the specific surface area is 5 to 300 nm; (b) the coefficient of variation in the particle diameter is 10% or less; and (c) the Sears number Y is 10.0 to 12.0.


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