The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 08, 2022

Filed:

Dec. 05, 2018
Applicant:

Denka Company Limited, Tokyo, JP;

Inventors:

Yoshitaka Minakata, Omuta, JP;

Eri Sasaki, Machida, JP;

Toshitaka Yamagata, Omuta, JP;

Saori Inoue, Omuta, JP;

Ryo Yoshimatu, Omuta, JP;

Ryuji Koga, Omuta, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 1/03 (2006.01); H05K 1/09 (2006.01); C04B 35/583 (2006.01); C04B 35/584 (2006.01); C04B 35/634 (2006.01); C04B 41/82 (2006.01); C04B 41/48 (2006.01); C04B 38/00 (2006.01); C08G 59/24 (2006.01); C09J 163/00 (2006.01); H05K 3/38 (2006.01);
U.S. Cl.
CPC ...
C04B 41/4853 (2013.01); C04B 38/0051 (2013.01); C04B 41/82 (2013.01); C08G 59/24 (2013.01); C09J 163/00 (2013.01); H05K 1/0313 (2013.01); H05K 3/386 (2013.01); C04B 2235/386 (2013.01); H05K 2201/10106 (2013.01);
Abstract

A nitride-based ceramics resin composite body having thermal conductivity, electrical insulation, and adhesion to adherends equal to conventional products, and having improved heat resistance reliability during the reflow process, and a thermal conductive insulating adhesive sheet using the same are provided. A nitride-based ceramics resin composite body in which a thermosetting resin composition is impregnated in a porous nitride-based ceramics sintered body is provided. The thermosetting resin composition includes a specific epoxy resin and a bismaleimide triazine resin, and a water absorption of the thermosetting resin composition in a completely cured state measured in accordance with method A in JIS K7209 (2000) is 1% by mass or less.


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