The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 08, 2022

Filed:

Jan. 04, 2021
Applicant:

P-chip Ip Holdings, Inc., Chicago, IL (US);

Inventors:

Ziye “Jay” Qian, Monroe Township, NJ (US);

Wlodek Mandecki, Princeton Junction, NJ (US);

Assignee:

P-CHIP IP HOLDINGS INC., Chicago, IL (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 65/00 (2006.01); B29C 65/02 (2006.01); H01L 21/683 (2006.01); H01L 21/67 (2006.01); H01L 23/498 (2006.01); H01L 23/544 (2006.01); B29L 31/34 (2006.01);
U.S. Cl.
CPC ...
B29C 66/863 (2013.01); B29C 65/02 (2013.01); H01L 21/67132 (2013.01); H01L 21/6838 (2013.01); H01L 23/49855 (2013.01); H01L 23/544 (2013.01); B29L 2031/34 (2013.01); H01L 2223/54413 (2013.01);
Abstract

Provided among other things is a method of affixing a small, single chip to a plastic item, the chip having a top surface having length and width dimensions, and having a height, the method comprising: (1) vacuum adhering a top-oriented surface of the chip to a probe of outer dimensions comparable to or smaller than those of the length and width; (2) conveying heat to the chip via the probe such that a bottom-oriented surface of the chip is sufficiently hot to melt the plastic; (3) applying via the probe the chip to the plastic such that the chip embeds in the plastic; and (4) releasing the chip from the probe, wherein the largest of the length and width is about 500 microns or less, and height is no more than about the smallest of length and width.


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