The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 08, 2022
Filed:
Jul. 29, 2020
Applicant:
Mitsubishi Chemical Corporation, Tokyo, JP;
Inventors:
Akiko Hirano, Tokyo, JP;
Shigeyuki Furomoto, Tokyo, JP;
Assignee:
Mitsubishi Chemical Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B29C 64/118 (2017.01); B29C 64/255 (2017.01); B33Y 30/00 (2015.01); B33Y 70/00 (2020.01); B29K 23/00 (2006.01); B29K 25/00 (2006.01); B29K 55/02 (2006.01);
U.S. Cl.
CPC ...
B29C 64/118 (2017.08); B29C 64/255 (2017.08); B29K 2023/12 (2013.01); B29K 2025/04 (2013.01); B29K 2055/02 (2013.01); B29K 2995/0039 (2013.01); B29K 2995/0041 (2013.01); B29K 2995/0097 (2013.01); B33Y 30/00 (2014.12); B33Y 70/00 (2014.12);
Abstract
Provided is a three-dimensional modeling material used for a fused deposition modeling three-dimensional printer. The three-dimensional modeling material has a multilayer structure and contains, in respective different layers, a thermoplastic resin (A) having a shear storage elastic modulus (G') of 1.00×10Pa or less as measured at 100° C. and 1 Hz and a thermoplastic resin (B) having a shear storage elastic modulus (G′) of more than 1.00×10Pa as measured at 100° C. and 1 Hz.