The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 08, 2022
Filed:
Oct. 06, 2017
University of Maryland, College Park, College Park, MD (US);
David M. Hymas, Annapolis, MD (US);
Serguei V. Dessiatoun, Colmar Manor, MD (US);
Michael M. Ohadi, Clarksville, MD (US);
UNIVERSITY OF MARYLAND, COLLEGE PARK, College Park, MD (US);
Abstract
In a metal fiber composite (MFC) additive manufacturing (AM) method, a layer of polymer structures is deposited using a fused filament fabrication (FFF) printer assembly comprising at least one nozzle. Subsequently, an MFC printer assembly is used to embed a continuous metal fiber into one or more of the polymer structures of the layer. The embedding is achieved by heating the metal fiber and applying pressure to the metal fiber using an embedding surface of the MFC printer assembly. The heated metal fiber melts polymer adjacent thereto, thereby allowing the pressure to embed the metal fiber into the polymer structure. Using the MFC-AM method, various composite structures can be formed, such as novel heat exchangers that may otherwise be difficult or impossible to fabricate via other manufacturing techniques.