The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 08, 2022

Filed:

Dec. 04, 2019
Applicant:

Mimaki Engineering Co., Ltd., Nagano, JP;

Inventors:

Kunio Hakkaku, Nagano, JP;

Kazuhiro Ochi, Nagano, JP;

Masakatsu Okawa, Nagano, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B29C 64/112 (2017.01); B29C 64/209 (2017.01); B33Y 10/00 (2015.01); B33Y 50/02 (2015.01); B29K 105/00 (2006.01); B33Y 30/00 (2015.01);
U.S. Cl.
CPC ...
B29C 64/112 (2017.08); B29C 64/209 (2017.08); B33Y 10/00 (2014.12); B33Y 30/00 (2014.12); B33Y 50/02 (2014.12); B29K 2105/0058 (2013.01); B29K 2995/002 (2013.01); B29K 2995/0026 (2013.01);
Abstract

A forming device that forms a 3D object includes a head section including a plurality of nozzle rows, and a scanning driving section that causes the head section to carry out a scanning operation; where the head section includes a first nozzle row group, a second nozzle row group, and a support nozzle row group; in an operation of at least one of the forming modes, the forming device forms at least one part of the 3D object using the first nozzle row group and the second nozzle row group and forms a support layer in a periphery of the 3D object; and when a maximum value of a material dischargeable in unit time in one scanning operation is defined as a material discharging ability, the material discharging ability of the support nozzle row group is greater than the material discharging ability of the first nozzle row group.


Find Patent Forward Citations

Loading…