The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 08, 2022
Filed:
May. 07, 2018
Applicant:
Pink Gmbh Thermosysteme, Wertheim, DE;
Inventors:
Aaron Hutzler, Nuremberg, DE;
Christoph Oetzel, Wertheim, DE;
Assignee:
PINK GmbH Thermosysteme, Wertheim, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 3/08 (2006.01); B23K 1/00 (2006.01); H01L 23/00 (2006.01); B23K 1/20 (2006.01); H01L 25/065 (2006.01); H01L 25/00 (2006.01); B23K 101/42 (2006.01);
U.S. Cl.
CPC ...
B23K 3/087 (2013.01); B23K 1/0016 (2013.01); B23K 1/206 (2013.01); H01L 24/75 (2013.01); H01L 24/81 (2013.01); H01L 24/83 (2013.01); H01L 25/0657 (2013.01); H01L 25/50 (2013.01); B23K 2101/42 (2018.08); H01L 24/16 (2013.01); H01L 24/17 (2013.01); H01L 24/32 (2013.01); H01L 24/33 (2013.01); H01L 24/73 (2013.01); H01L 24/92 (2013.01); H01L 2224/16145 (2013.01); H01L 2224/17181 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/33181 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/73253 (2013.01); H01L 2224/7501 (2013.01); H01L 2224/75252 (2013.01); H01L 2224/75301 (2013.01); H01L 2224/81203 (2013.01); H01L 2224/81801 (2013.01); H01L 2224/81911 (2013.01); H01L 2224/83203 (2013.01); H01L 2224/83801 (2013.01); H01L 2224/83911 (2013.01); H01L 2224/9211 (2013.01); H01L 2225/06513 (2013.01);
Abstract
The invention relates to a method for producing a solder connection between a plurality of components (A,B) in a process chamber () sealed off from its surroundings by heating and melting solder material () which is arranged between the components (A,B) to be connected. It is proposed that the components (A,B) to be connected are provisionally connected with a bonding material () to form a solder group () in which the components (A,B) are fixed relative to one another in a joining position.