The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 08, 2022

Filed:

Jul. 09, 2020
Applicants:

Ut-battelle, Llc, Oak Ridge, TN (US);

University of Tennessee Research Foundation, Knoxville, TN (US);

Iowa State University Research Foundation, Inc., Ames, IA (US);

Eck Industries Incorporated, Manitowoc, WI (US);

Inventors:

Alex J. Plotkowski, Knoxville, TN (US);

Orlando Rios, Knoxville, TN (US);

Sudarsanam Suresh Babu, Knoxville, TN (US);

Ryan R. Dehoff, Knoxville, TN (US);

Ryan Ott, Ames, IA (US);

Zachary C. Sims, Knoxville, TN (US);

Niyanth Sridharan, Knoxville, TN (US);

David Weiss, Manitowoc, WI (US);

Hunter B. Henderson, Knoxville, TN (US);

Assignees:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B22F 10/20 (2021.01); C22C 21/08 (2006.01); C22C 21/06 (2006.01); C22C 21/00 (2006.01); C22C 1/04 (2006.01); B22F 10/00 (2021.01); B33Y 10/00 (2015.01); C21D 1/10 (2006.01); C22F 1/04 (2006.01); C22C 21/16 (2006.01); B33Y 80/00 (2015.01); B23K 26/354 (2014.01); B22D 21/00 (2006.01); C22C 1/03 (2006.01); C22C 28/00 (2006.01); C22C 30/06 (2006.01); C22C 23/06 (2006.01);
U.S. Cl.
CPC ...
B22F 10/20 (2021.01); B22D 21/007 (2013.01); B22F 10/00 (2021.01); B23K 26/354 (2015.10); B33Y 10/00 (2014.12); B33Y 80/00 (2014.12); C21D 1/10 (2013.01); C22C 1/03 (2013.01); C22C 1/0416 (2013.01); C22C 21/00 (2013.01); C22C 21/06 (2013.01); C22C 21/08 (2013.01); C22C 21/16 (2013.01); C22C 28/00 (2013.01); C22C 30/06 (2013.01); C22F 1/04 (2013.01); C22C 23/06 (2013.01); Y02P 10/25 (2015.11);
Abstract

Described herein are additive manufacturing methods and products made using such methods. The alloy compositions described herein are specifically selected for the additive manufacturing methods and provide products that exhibit superior mechanical properties as compared to their cast counterparts. Using the compositions and methods described herein, products that do not exhibit substantial coarsening, such as at elevated temperatures, can be obtained. The products further exhibit uniform microstructures along the print axis, thus contributing to improved strength and performance. Additives also can be used in the alloys described herein.


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