The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 01, 2022
Filed:
Sep. 23, 2019
Applicant:
Asti Global Inc., Taiwan, Changhua County, TW;
Inventor:
Chien-Shou Liao, New Taipei, TW;
Assignee:
ASTI GLOBAL INC., TAIWAN, Taichung, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 13/04 (2006.01); H01L 23/00 (2006.01); H01L 33/32 (2010.01); B23K 26/57 (2014.01); B23K 26/14 (2014.01);
U.S. Cl.
CPC ...
H05K 13/0486 (2013.01); B23K 26/1464 (2013.01); B23K 26/57 (2015.10); H01L 24/98 (2013.01); H01L 33/32 (2013.01); H05K 13/0409 (2018.08);
Abstract
A chip removing device and a chip removing method are provided. The chip removing device includes: a carrier substrate, a laser generation module, and a blowing module. The carrier substrate carries at least one substrate, and a plurality of chips disposed on the substrate. The laser generation module corresponds to the carrier substrate and is used to apply a laser beam to the chip to reduce the bonding force between the chip and the substrate. The blowing module is disposed above the carrier substrate and close to the substrate for applying a gas to the chip to blow the chip away from the substrate.