The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 01, 2022
Filed:
Mar. 08, 2019
Applicant:
Nippon Telegraph and Telephone Corporation, Tokyo, JP;
Inventors:
Hiroshi Hamada, Tokyo, JP;
Hideyuki Nosaka, Tokyo, JP;
Assignee:
NIPPON TELEGRAPH AND TELEPHONE CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 9/00 (2006.01); H01P 3/08 (2006.01); H04B 10/80 (2013.01); H05K 1/02 (2006.01); H05K 7/14 (2006.01);
U.S. Cl.
CPC ...
H05K 9/0049 (2013.01); H01P 3/081 (2013.01); H04B 10/80 (2013.01); H05K 1/0237 (2013.01); H05K 7/1427 (2013.01); H05K 2201/10363 (2013.01);
Abstract
A high-frequency module includes: a chassis which is made of a conductor and which has an internal space; a high-frequency circuit board which is housed in the internal space of the chassis; and a resistive element provided between an inner wall that opposes the high-frequency circuit board among inner walls of the chassis which define the internal space and the high-frequency circuit board.