The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 01, 2022
Filed:
Aug. 01, 2017
Applicant:
Nhk Spring Co., Ltd., Yokohama, JP;
Inventors:
Katsumi Mizuno, Yokohama, JP;
Daiki Ikeda, Yokohama, JP;
Assignee:
NHK SPRING CO., LTD., Yokohama, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/05 (2006.01); H05K 1/02 (2006.01); H05K 3/30 (2006.01); H05K 3/44 (2006.01); H05K 3/20 (2006.01); H05K 1/03 (2006.01); H05K 3/10 (2006.01);
U.S. Cl.
CPC ...
H05K 1/056 (2013.01); H05K 1/0256 (2013.01); H05K 1/0373 (2013.01); H05K 3/20 (2013.01); H05K 3/44 (2013.01); H05K 1/0201 (2013.01); H05K 1/0263 (2013.01); H05K 3/103 (2013.01); H05K 3/202 (2013.01); H05K 2201/0137 (2013.01); H05K 2201/09672 (2013.01); H05K 2201/09727 (2013.01); H05K 2201/1028 (2013.01); H05K 2203/0278 (2013.01); H05K 2203/1105 (2013.01);
Abstract
According to one embodiment, a metal base circuit board includes a metal base substrate, a first circuit pattern, and a first insulating layer between the metal base substrate and the first circuit pattern. The first insulating layer covers a lower surface of the first circuit pattern and at least part of a side surface of the first circuit pattern, the lower surface facing the metal base substrate, the at least part of the side surface being adjacent to the lower surface.