The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 01, 2022

Filed:

Jul. 29, 2021
Applicant:

Lenovo (Singapore) Pte. Ltd., Singapore, SG;

Inventors:

Wenjin Niu, Kanagawa, JP;

Jun Iwasaki, Kanagawa, JP;

Toshikazu Horino, Kanagawa, JP;

Toshinari Sumikawa, Kanagawa, JP;

Shigehiro Horiuchi, Kanagawa, JP;

Takehito Yamauchi, Kanagawa, JP;

Yalu Liu, Kanagawa, JP;

Keita Ishikawa, Kanagawa, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04R 1/04 (2006.01); H04R 19/04 (2006.01);
U.S. Cl.
CPC ...
H04R 1/04 (2013.01); H04R 19/04 (2013.01);
Abstract

An electronic device includes a chassis, a microphone hole penetrating an outer wall of the chassis, and a microphone module that faces the microphone hole. The microphone module has a microphone that obtains sound information outside the chassis through the microphone hole, a flexible substrate laminated on a back surface of the microphone, a metallic plate laminated on a back surface of the flexible substrate, and a sound hole opened in the back surface of the microphone and penetrating the flexible substrate and the metallic plate. The electronic device further includes a double-sided tape fastened to a first region, surrounding the sound hole, of a back surface of the metallic plate, and to an inner surface of the chassis, and that fixes the microphone module to the chassis, and a conductive member that electrically connects the second region of the metallic plate and the inner surface of the chassis.


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