The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 01, 2022
Filed:
Apr. 08, 2021
Applicant:
Murata Manufacturing Co., Ltd., Nagaokakyo, JP;
Inventor:
Naoya Matsumoto, Nagaokakyo, JP;
Assignee:
MURATA MANUFACTURING CO., LTD., Nagaokakyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04B 1/40 (2015.01); H03F 3/24 (2006.01); H03F 1/02 (2006.01); H03F 1/30 (2006.01); H03F 1/56 (2006.01); H01L 23/66 (2006.01); H04B 1/04 (2006.01);
U.S. Cl.
CPC ...
H04B 1/40 (2013.01); H01L 23/66 (2013.01); H03F 1/0211 (2013.01); H03F 1/30 (2013.01); H03F 1/565 (2013.01); H03F 3/245 (2013.01); H01L 2223/6655 (2013.01); H03F 2200/222 (2013.01); H03F 2200/294 (2013.01); H03F 2200/451 (2013.01); H03F 2200/468 (2013.01); H04B 2001/0408 (2013.01);
Abstract
A radio-frequency module includes a module substrate, a power amplifier, and a control circuit configured to control the power amplifier. The control circuit includes a temperature sensor. The power amplifier and the control circuit are stacked one on top of another on a principal surface of the module substrate.