The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 01, 2022

Filed:

Feb. 28, 2019
Applicant:

Aisin Corporation, Kariya, JP;

Inventor:

Hideaki Kimura, Okazaki, JP;

Assignee:

AISIN CORPORATION, Kariya, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H02K 15/06 (2006.01); H02K 3/34 (2006.01); H02K 3/48 (2006.01); H02K 15/10 (2006.01);
U.S. Cl.
CPC ...
H02K 15/065 (2013.01); H02K 3/34 (2013.01); H02K 3/48 (2013.01); H02K 15/105 (2013.01);
Abstract

A method for manufacturing an armature () includes: a coil disposing step involving using a thermally expandable resin (Q) that expands by application of heat, and disposing a coil () in a core () such that the thermally expandable resin (Q) before expansion is disposed between a slot-housed portion () and an inner surface of a slot (); a resin disposing step involving, before or after the coil disposing step, using a thermally melting resin (P) that melts by application of heat, and disposing the thermally melting resin (P) before melting such that the thermally melting resin (P) comes into contact with coil end portions (); and a heating step involving, after the coil disposing step and the resin disposing step, heating, expanding, and then curing the thermally expandable resin (Q), and heating, melting, and then curing the thermally melting resin (P).


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