The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 01, 2022
Filed:
Oct. 28, 2019
The Boeing Company, Chicago, IL (US);
Damien O. Martin, Everett, WA (US);
Lars E. Blacken, Bothell, WA (US);
Bradley J. Mitchell, Everett, WA (US);
Grace L. Duncan, Seattle, WA (US);
Eerik J. Helmick, Seattle, WA (US);
Keith M. Cutler, Kirkland, WA (US);
Randall V. Fraker, Everett, WA (US);
Alexey S. Meerov, Mukilteo, WA (US);
John R. Porter, Edgewood, WA (US);
The Boeing Company, Chicago, IL (US);
Abstract
Systems and methods for designing and assembling form boards with attached wire routing devices for use in wire bundle assembly. The assembly method comprises: (a) establishing a coordinate system of a form board having a multiplicity of holes; (b) using a computer system to determine locations of form board devices of different types with reference to the coordinate system of the form board based on engineering data specifying a wire bundle configuration; and (c) fastening the form board devices of different types to respective holes of the form board having centers closest to respective locations determined in step (b). The form board devices may be inserted robotically or manually.