The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 01, 2022

Filed:

May. 28, 2019
Applicant:

Nederlandse Organisatie Voor Toegepast-natuurwetenschappelijk Onderzoek Tno, 's-Gravenhage, NL;

Inventors:

Hylke Broer Akkerman, Rosmalen, NL;

Petrus Cornelis Paulus Bouten, Eindhoven, NL;

Ahmed Fawzy, Eindhoven, NL;

Venkata Krishna Pradeep Panditha, Eindhoven, NL;

Joris Franciscus Johannes De Riet, Eindhoven, NL;

Raghu Kishore Pendyala, Hyderabad, IN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 51/00 (2006.01); H01L 27/32 (2006.01);
U.S. Cl.
CPC ...
H01L 51/0097 (2013.01); H01L 27/3244 (2013.01); H01L 2251/5338 (2013.01); H01L 2251/558 (2013.01);
Abstract

A foldable thin film device assembly is provided comprising: a flexible thin film device with a thickness smaller than 50 micrometer. The thin film device has a stack of electroactive layers formed on a substrate. A protective inorganic capping layer caps the stack of electroactive layers and a backside elastomeric layer backs the flexible thin film device. A frontside transparent elastomeric layer covers the flexible thin film device, and backside and frontside flexible layers are dimensioned to mechanically form a neutral line for the protective inorganic layer. The elastomeric material has a Young's modulus smaller than 100 MPa smaller than 100 MPa and thickness larger than 100 micron, with a flexural rigidity equal or larger than the thin film device.


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