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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11489119 B1

PDFFull Text
Date of Patent:
Nov. 01, 2022

Filed:

Sep. 18, 2019

Apparatus and techniques for electronic device encapsulation

Applicant:

Kateeva, Inc., Newark, CA (US);

Inventors:

Alexander Sou-Kang Ko, Santa Clara, CA (US);

Justin Mauck, Belmont, CA (US);

Eliyahu Vronsky, Los Altos, CA (US);

Conor F. Madigan, San Francisco, CA (US);

Eugene Rabinovich, Fremont, CA (US);

Nahid Harjee, Sunnyvale, CA (US);

Christopher Buchner, Sunnyvale, CA (US);

Gregory Lewis, Mountain View, CA (US);

Assignee:

Kateeva, Inc., Newark, CA (US);

Attorney:

Hauptman Ham, LLP

Primary Examiner:

Binu Thomas

Int. Cl.
CPC ...
B05D 5/00 (2006.01); B41J 11/00 (2006.01); H01L 51/00 (2006.01); H01L 51/52 (2006.01); B05B 15/60 (2018.01); B05C 13/00 (2006.01); B05C 15/00 (2006.01); B41J 2/01 (2006.01); B41J 3/407 (2006.01); H01L 21/67 (2006.01); H01L 21/677 (2006.01); H01L 51/56 (2006.01); H01L 21/673 (2006.01); B05D 3/06 (2006.01); C09D 11/101 (2014.01);
U.S. Cl.
CPC ...
H01L 51/0004 (2013.01); B05B 15/60 (2018.02); B05C 13/00 (2013.01); B05C 15/00 (2013.01); B05D 3/065 (2013.01); B05D 5/00 (2013.01); B41J 2/01 (2013.01); B41J 3/407 (2013.01); B41J 11/0015 (2013.01); H01L 21/6715 (2013.01); H01L 21/6719 (2013.01); H01L 21/6776 (2013.01); H01L 21/67115 (2013.01); H01L 21/67161 (2013.01); H01L 21/67184 (2013.01); H01L 21/67207 (2013.01); H01L 21/67383 (2013.01); H01L 21/67784 (2013.01); H01L 51/00 (2013.01); H01L 51/0005 (2013.01); H01L 51/0029 (2013.01); H01L 51/5253 (2013.01); H01L 51/56 (2013.01); B41J 11/00214 (2021.01); C09D 11/101 (2013.01);
Abstract

A method for providing a substrate coating comprises transferring a substrate to an enclosed ink jet printing system; printing organic material in a deposition region of the substrate using the enclosed ink jet printing system, the deposition region comprising at least a portion of an active region of a light-emitting device on the substrate; loading the substrate with the organic material deposited thereon to an enclosed curing module; supporting the substrate in the enclosed curing module, the supporting the substrate comprising floating the substrate on a gas cushion established by a floatation support apparatus; and while supporting the substrate in the enclosed curing module, curing the organic material deposited on the substrate to form an organic film layer.

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