The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 01, 2022

Filed:

Jun. 29, 2021
Applicant:

Trixell, Moirans, FR;

Inventor:

Yannick Janvier, Moirans, FR;

Assignee:

TRIXELL, Moirans, FR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/146 (2006.01); G01T 1/24 (2006.01);
U.S. Cl.
CPC ...
H01L 27/1469 (2013.01); G01T 1/24 (2013.01); H01L 27/14661 (2013.01); H01L 27/14698 (2013.01);
Abstract

A method for producing an imager includes the following steps: a. attaching an imaging sensor to a first substrate; b. cutting out the first substrate a predefined distance around the attached imaging sensor; c. attaching a driver circuit board for driving the imaging sensor to the cut-out first substrate, close to the attached imaging sensor; d. connecting the driver circuit board for driving the imaging sensor to the attached imaging sensor in order to obtain a first tile; e. repeating the attaching, cutting-out, attaching, and connecting steps in order to obtain a second tile; f. butting together the obtained first tile and second tile by placing the cut-out first substrates in edge-to-edge contact; g. attaching the butted-together tiles to a main substrate; h. connecting the driver circuit boards of the imaging sensors of the butted-together first tile and second tile to a motherboard of the imager.


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