The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 01, 2022

Filed:

May. 07, 2021
Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Naveed Zaman, Saratoga, CA (US);

Myron Shak, San Jose, CA (US);

Tameesh Suri, San Jose, CA (US);

Bilal Shafi Sheikh, Sunnyvale, CA (US);

Assignee:

Applied Materials, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G11C 5/06 (2006.01); H01L 25/065 (2006.01); G11C 11/412 (2006.01); H01L 23/522 (2006.01); H01L 27/11 (2006.01); H01L 23/528 (2006.01);
U.S. Cl.
CPC ...
H01L 25/0655 (2013.01); G11C 5/06 (2013.01); G11C 11/412 (2013.01); H01L 23/528 (2013.01); H01L 23/5221 (2013.01); H01L 27/1104 (2013.01);
Abstract

A network-on-package (NoPK) for connecting a plurality of chiplets may include a plurality of interface bridges configured to convert a plurality of protocols used by the plurality of chiplets into a common protocol, a routing network configured to route traffic between the plurality of interface bridges using the common protocol, and a controller configured to program the plurality of interface bridges and the routing network based on types of the plurality of chiplets connected to the NoPK. The NoPK may provide a scalable connection for any number of chiplets from different ecosystems using different communication protocols.


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