The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 01, 2022
Filed:
Aug. 08, 2019
Samsung Electro-mechanics Co., Ltd., Suwon-si, KR;
Jung Hyun Cho, Suwon-si, KR;
Young Kwan Lee, Suwon-si, KR;
Young Sik Hur, Suwon-si, KR;
Yun Tae Lee, Suwon-si, KR;
Ho Kwon Yoon, Suwon-si, KR;
SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si, KR;
Abstract
A bridge embedded interposer and a package substrate and a semiconductor package including the same includes: a connection structure including one or more redistribution layers, a first bridge disposed on the connection structure and including one or more first circuit layers electrically connected to the one or more redistribution layers, a frame disposed around the first bridge on the connection structure and including one or more wiring layers electrically connected to the one or more redistribution layers, and an encapsulant disposed on the connection structure and covering at least a portion of each of the first bridge and the frame.