logo

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11488899 B1

PDFFull Text
Date of Patent:
Nov. 01, 2022

Filed:

Jul. 28, 2020

Package device

Applicant:

Innolux Corporation, Miao-Li County, TW;

Inventors:

Hsueh-Hsuan Chou, Miao-Li County, TW;

Chia-Chieh Fan, Miao-Li County, TW;

Kuan-Jen Wang, Miao-Li County, TW;

Cheng-Chi Wang, Miao-Li County, TW;

Yi-Hung Lin, Miao-Li County, TW;

Li-Wei Sung, Miao-Li County, TW;

Assignee:

InnoLux Corporation, Miao-Li County, TW;

Attorney:

Winston Hsu

Primary Examiner:

Nicholas J Tobergte

Int. Cl.
CPC ...
H01L 23/498 (2006.01); H01L 23/31 (2006.01); H01L 21/683 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 23/00 (2006.01); H01L 25/00 (2006.01); H01L 25/065 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49822 (2013.01); H01L 21/4853 (2013.01); H01L 21/4857 (2013.01); H01L 21/4864 (2013.01); H01L 21/568 (2013.01); H01L 21/6835 (2013.01); H01L 23/3114 (2013.01); H01L 23/3142 (2013.01); H01L 23/49816 (2013.01); H01L 23/49838 (2013.01); H01L 21/561 (2013.01); H01L 23/3128 (2013.01); H01L 23/49811 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 24/81 (2013.01); H01L 24/97 (2013.01); H01L 25/0655 (2013.01); H01L 25/50 (2013.01); H01L 2221/68345 (2013.01); H01L 2221/68359 (2013.01); H01L 2221/68381 (2013.01); H01L 2224/13111 (2013.01); H01L 2224/13144 (2013.01); H01L 2224/13155 (2013.01); H01L 2224/16238 (2013.01); H01L 2224/81005 (2013.01); H01L 2224/81192 (2013.01); H01L 2224/81805 (2013.01); H01L 2224/95001 (2013.01); H01L 2224/97 (2013.01); H01L 2924/14 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/15313 (2013.01); H01L 2924/18161 (2013.01); H01L 2924/37001 (2013.01);
Abstract

The present disclosure provides a package device including a conductive pad, a protecting block, and a redistribution layer. The protecting block is disposed on the conductive pad. The redistribution layer is disposed on the protecting block, and the conductive pad is electrically connected to the redistribution layer through the protecting block.

Find Patent Forward Citations

Quick Actions:

Chou, Hsueh-Hsuan. (2022). Package device (U.S. Patent No. 11488899). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11488899

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…