The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 01, 2022

Filed:

Aug. 03, 2021
Applicant:

Denso Corporation, Kariya, JP;

Inventors:

Hiroshi Ishino, Kariya, JP;

Hirokazu Sampei, Kariya, JP;

Assignee:

DENSO CORPORATION, Kariya, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49537 (2013.01); H01L 23/49534 (2013.01); H01L 23/49586 (2013.01); H01L 23/562 (2013.01);
Abstract

In a semiconductor device, a first lead frame and a second lead frame are fixed to a metal conductor base by an organic insulating film made of a polyimide-based material. The organic insulating film satisfies relationships of t>tand t>t, where tis a thickness of a portion of the organic insulating film sandwiched between the metal conductor base and the first lead frame, tis a thickness of a portion of the organic insulating film sandwiched between the metal conductor base and the second lead frame, and tis a thickness of a portion of the organic insulating film that is not sandwiched between the metal conductor base and the first lead frame and is not sandwiched between the metal conductor base and the second lead frame.


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