The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 01, 2022

Filed:

Dec. 24, 2019
Applicant:

Microchip Technology Caldicot Limited, Caldicot, GB;

Inventors:

Philip Andrew Swire, Chepstow, GB;

Nina Biddle, Coleford, GB;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/34 (2006.01); H01L 23/373 (2006.01); H01L 23/498 (2006.01); H01L 23/367 (2006.01); H05K 1/02 (2006.01); H05K 1/14 (2006.01); H05K 3/36 (2006.01); C23C 16/27 (2006.01); H05K 3/34 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3732 (2013.01); C23C 16/27 (2013.01); H01L 23/3677 (2013.01); H01L 23/49816 (2013.01); H05K 1/0209 (2013.01); H05K 1/145 (2013.01); H05K 3/3485 (2020.08); H05K 3/368 (2013.01);
Abstract

A method and apparatus for conducting heat away from a semiconductor die are disclosed. A board assembly is disclosed that includes a circuit board, a semiconductor die electrically coupled to the circuit board and a Chemical Vapor Deposition Diamond (CVDD) coated wire. A portion of the CVDD-coated wire extends between a hot-spot on the semiconductor die and the circuit board. The board assembly includes a layer of thermally conductive paste that is disposed between the hot-spot on the semiconductor die and the circuit board. The layer of thermally conductive paste is in direct contact with a portion of the CVDD-coated wire.


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