The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 01, 2022

Filed:

Apr. 24, 2018
Applicant:

Jusung Engineering Co., Ltd., Gwangju-si, KR;

Inventors:

Kwang Su Yoo, Gwangju-si, KR;

Teugki Park, Gwangju-si, KR;

Yong Hyun Lee, Seongnam-si, KR;

Cheol Woo Chong, Seoul, KR;

Assignee:
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01J 37/32 (2006.01); C23C 16/50 (2006.01);
U.S. Cl.
CPC ...
H01J 37/32651 (2013.01); C23C 16/50 (2013.01); H01J 37/3244 (2013.01); H01J 37/32091 (2013.01); H01J 37/32183 (2013.01); H01J 37/32724 (2013.01); H01J 2237/002 (2013.01); H01J 2237/3321 (2013.01); H01J 2237/3323 (2013.01);
Abstract

A capacitively coupled plasma substrate processing apparatus includes: a process chamber which is exhausted to vacuum and provides a sealed internal space; a gas inflow pipe which is connected to the process chamber to provide a process gas into the process chamber; a gas distribution unit which is connected to the gas inflow pipe to inject the process gas flowing into the gas inflow pipe in the internal space; an impedance matching network which is disposed outside the process chamber and transfers an RF power of an RF power supply to the gas distribution unit; an RF connection line which connects an output of the impedance matching network to the gas inflow pipe or the gas distribution unit; and a shielding plate which is configured such that at least one of the RF connection line and the gas inflow pipe penetrates the shielding plate and includes a ferromagnetic material.


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Yoo, Kwang. (2022). Substrate processing apparatus (U.S. Patent No. 11488809). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11488809

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