The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 01, 2022

Filed:

Apr. 22, 2021
Applicant:

Samsung Electro-mechanics Co., Ltd., Suwon-si, KR;

Inventors:

Byeong Chan Kwon, Suwon-si, KR;

Ji Hun Lee, Suwon-si, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01G 4/30 (2006.01); H01G 4/224 (2006.01); H01G 4/12 (2006.01);
U.S. Cl.
CPC ...
H01G 4/224 (2013.01); H01G 4/1227 (2013.01); H01G 4/30 (2013.01); H01G 4/308 (2013.01);
Abstract

A multilayer ceramic electronic component includes a ceramic body including a dielectric layer and first and second internal electrodes, a first external electrode connected to the first internal electrode, and a second external electrode connected to the second internal electrode. The ceramic body includes a capacitance formation portion having first and a second surfaces opposing each other in a first direction, third and fourth surfaces opposing each other in a second direction, and fifth and sixth surfaces opposing each other in a third direction, the ceramic body including a first margin portion disposed on the third and fifth surfaces and a second margin portion disposed on the fourth and sixth surfaces.


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Kwon, Byeong. (2022). Multilayer ceramic electronic component and method of manufacturing the same (U.S. Patent No. 11488777). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11488777

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