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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11488772 B1

PDFFull Text
Date of Patent:
Nov. 01, 2022

Filed:

Sep. 10, 2018

Coil component and method of manufacturing the same

Applicant:

Tdk Corporation, Tokyo, JP;

Inventors:

Yuuichi Kawaguchi, Tokyo, JP;

Masanori Suzuki, Tokyo, JP;

Naoaki Fujii, Tokyo, JP;

Assignee:

TDK CORPORATION, Tokyo, JP;

Attorney:

Oliff PLC

Primary Examiner:

Mang Tin Bik Lian

Int. Cl.
CPC ...
H01F 27/24 (2006.01); H01F 41/02 (2006.01); H01F 27/28 (2006.01); H01F 41/04 (2006.01); H01F 41/12 (2006.01); H01F 27/32 (2006.01); H01F 27/29 (2006.01); H01F 17/00 (2006.01); H01F 3/10 (2006.01); H01F 17/04 (2006.01);
U.S. Cl.
CPC ...
H01F 41/0233 (2013.01); H01F 17/0013 (2013.01); H01F 27/24 (2013.01); H01F 27/2804 (2013.01); H01F 27/29 (2013.01); H01F 27/323 (2013.01); H01F 41/041 (2013.01); H01F 41/046 (2013.01); H01F 41/122 (2013.01); H01F 2003/106 (2013.01); H01F 2017/0066 (2013.01); H01F 2017/048 (2013.01); H01F 2027/2809 (2013.01);
Abstract

Provided is a coil component that includes a coil part having a planar coil that includes a winding section and an insulating section covering the winding section, and a magnetic resin layer including a magnetic filler and configured to cover the coil part. The magnetic resin layer has a first magnetic resin layer that is in contact with the coil part and a second magnetic resin layer that is laminated on the first magnetic resin layer. The second magnetic resin layer constitutes a principal surface of the magnetic resin layer, and a maximum particle size of the magnetic filler contained in the second magnetic resin layer is larger than that of the magnetic filler contained in the first magnetic resin layer.

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