The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 01, 2022
Filed:
Nov. 04, 2019
Applicant:
Samsung Electro-mechanics Co., Ltd., Suwon-si, KR;
Inventors:
Dong Seob Lee, Suwon-si, KR;
Jong Min Lee, Suwon-si, KR;
Assignee:
SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si, KR;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01F 27/29 (2006.01); H01F 3/08 (2006.01); H01F 17/04 (2006.01); H01F 27/02 (2006.01); H01F 27/30 (2006.01); H01F 27/32 (2006.01);
U.S. Cl.
CPC ...
H01F 27/292 (2013.01); H01F 3/08 (2013.01); H01F 17/04 (2013.01); H01F 27/022 (2013.01); H01F 27/306 (2013.01); H01F 27/324 (2013.01); H01F 2017/048 (2013.01);
Abstract
A coil component includes an insulating substrate; a coil portion disposed on at least one surface of the insulating substrate; and a body embedding the insulating substrate and the coil portion and having an active portion in which the coil portion is disposed, and a cover portion disposed on the active portion. A ratio of a thickness (T) of the cover portion to a thickness (T) of the insulating substrate satisfies 3<T/T<6, and the thickness (T) of the cover portion satisfies 90 μm<T<120 μm.