The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 01, 2022
Filed:
Oct. 07, 2016
Hitachi Metals, Ltd., Tokyo, JP;
Keisuke Sugita, Tokyo, JP;
Akinari Nakayama, Tokyo, JP;
Hitachi Metals, Ltd., Tokyo, JP;
Abstract
A molded cable comprises a conductor, an insulation inner layer, an insulation outer layer, and a resin molded body. The insulation inner layer comprises a crosslinked ethylene resin composition and is provided an outer circumference of the conductor. The insulation outer layer comprises a crosslinked thermoplastic polyurethane composition and is provided on an outer circumference of the insulation inner layer. Arithmetic average roughness (Ra) of a surface of the insulation outer layer is 5 μm to 100 μm. The resin molded body coats an exposed end portion of the conductor and an end portion of the insulation outer layer at a side of the exposed end portion of the conductor. The resin molded body is fused to the insulation outer layer.