The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 01, 2022
Filed:
Jun. 24, 2020
Applicant:
Sandisk Technologies Llc, Addison, TX (US);
Inventors:
Assignee:
SanDisk Technologies LLC, Addison, TX (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G11C 29/14 (2006.01); G11C 29/44 (2006.01); G11C 29/42 (2006.01); G11C 29/46 (2006.01); G11C 16/26 (2006.01); G11C 16/10 (2006.01); G11C 29/12 (2006.01);
U.S. Cl.
CPC ...
G11C 29/44 (2013.01); G11C 16/10 (2013.01); G11C 16/26 (2013.01); G11C 29/14 (2013.01); G11C 29/42 (2013.01); G11C 29/46 (2013.01); G11C 2029/1202 (2013.01); G11C 2029/1204 (2013.01); G11C 2029/1208 (2013.01); G11C 2207/2254 (2013.01);
Abstract
An integrated memory assembly comprises a memory die and a control die bonded to the memory die. The memory die includes a memory structure of non-volatile memory cells. The control die is configured to program user data to and read user data from the memory die based on one or more operational parameters. The control die is configured to calibrate the one or more operational parameters for the memory die. The control die is also configured to perform testing of the memory die using the calibrated one or more operational parameters.