The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 01, 2022
Filed:
Sep. 02, 2021
Applicant:
Fujifilm Business Innovation Corp., Tokyo, JP;
Inventors:
Kenji Omori, Kanagawa, JP;
Hideaki Ohara, Kanagawa, JP;
Tomotake Inagaki, Kanagawa, JP;
Hitoshi Komuro, Kanagawa, JP;
Jun Kimura, Kanagawa, JP;
Assignee:
FUJIFILM Business Innovation Corp., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G03G 15/20 (2006.01);
U.S. Cl.
CPC ...
G03G 15/2057 (2013.01); G03G 15/2053 (2013.01); G03G 15/206 (2013.01); G03G 15/2017 (2013.01); G03G 2215/2016 (2013.01); G03G 2215/2048 (2013.01); G03G 2215/2051 (2013.01); G03G 2215/2054 (2013.01);
Abstract
An endless belt includes a metal substrate, and a heat-resistant resin layer that is disposed as an innermost layer on an inner peripheral surface of the metal substrate and that contains a resin and a thermally conductive filler having an aspect ratio of 20 or more. In the heat-resistant resin layer, an orientation ratio of the thermally conductive filler with respect to a circumferential direction of the endless belt is 20% or more.