The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 01, 2022

Filed:

Jun. 10, 2020
Applicant:

Tdk-micronas Gmbh, Freiburg, DE;

Inventors:

Maria-Cristina Vecchi, Freiburg, DE;

Reinhard Erwe, Freiburg, DE;

Martin Cornils, Freiburg, DE;

Kerwin Khu, Freiburg, DE;

Assignee:

TDK-Micronas GmbH, Freiburg, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01R 33/07 (2006.01); H01L 43/04 (2006.01); H01L 43/06 (2006.01); G01R 33/06 (2006.01);
U.S. Cl.
CPC ...
G01R 33/07 (2013.01); G01R 33/066 (2013.01); H01L 43/04 (2013.01); H01L 43/065 (2013.01);
Abstract

An isolating Hall sensor structure having a support structure made of a substrate layer and an oxide layer, a semiconductor region of a first conductivity type which is integrally connected to a top side of the oxide layer, at least one trench extending from the top side of the semiconductor region to the oxide layer of the support structure, at least three first semiconductor contact regions of the first conductivity type, each extending from a top side of the semiconductor region into the semiconductor region. The at least one trench surrounds a box region of the semiconductor region. The first semiconductor contact regions are each arranged in the box region of the semiconductor region and are each spaced apart from one another. A metallic connection contact layer is arranged on each first semiconductor contact region.


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