The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 01, 2022

Filed:

Jan. 08, 2021
Applicant:

Taiwan Textile Research Institute, New Taipei, TW;

Inventors:

Chen-Shou Hsu, New Taipei, TW;

Sun-Wen Juan, New Taipei, TW;

Chun-Hung Lin, New Taipei, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
D06N 3/12 (2006.01); C08G 65/333 (2006.01); C09D 175/12 (2006.01); C08G 18/08 (2006.01); C08G 18/28 (2006.01); C08G 18/80 (2006.01); C08G 18/32 (2006.01); C08G 18/48 (2006.01); C08G 18/79 (2006.01);
U.S. Cl.
CPC ...
D06N 3/12 (2013.01); C08G 18/0814 (2013.01); C08G 18/285 (2013.01); C08G 18/3203 (2013.01); C08G 18/4833 (2013.01); C08G 18/791 (2013.01); C08G 18/807 (2013.01); C08G 65/33396 (2013.01); C09D 175/12 (2013.01); D06N 2209/147 (2013.01);
Abstract

An anti-staining fabric includes a base cloth and an anti-staining resin. The anti-staining resin is disposed on the base cloth, in which a method of fabricating the anti-staining resin includes the following steps. A first thermal process is performed to mix a polyol, a cross-linking agent, and a choline to form a first mixture, in which a reaction temperature of the first thermal process is between 90° C. and 120° C. A second thermal process is performed to mix the first mixture and a chain extender to form the anti-staining resin, in which the chain extender includes a first reagent and a second reagent, and a reaction temperature of the second thermal process is between 120° C. and 150° C.


Find Patent Forward Citations

Loading…