The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 01, 2022
Filed:
Jan. 17, 2019
Applicant:
Viavi Solutions Inc., San Jose, CA (US);
Inventors:
Adam Andrew Preuss, Santa Rosa, CA (US);
Richard A. Bradley, Jr., Santa Rosa, CA (US);
Georg J. Ockenfuss, Santa Rosa, CA (US);
Markus K. Tilsch, Santa Rosa, CA (US);
Andrew Clark, Santa Rosa, CA (US);
Marius Grigonis, Santa Rosa, CA (US);
Andy Shkabko, Santa Rosa, CA (US);
Nicolas Alexander Davis, Santa Rosa, CA (US);
Anthony Jay Kemp Cottrell, Santa Rosa, CA (US);
Assignee:
VIAVI SOLUTIONS INC., San Jose, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23C 28/00 (2006.01); C23C 4/131 (2016.01); C23C 4/08 (2016.01); C23C 4/134 (2016.01); C23C 4/067 (2016.01); C23C 14/16 (2006.01); C23C 14/34 (2006.01); C23C 4/06 (2016.01); C23C 16/02 (2006.01); H01J 37/32 (2006.01); C23C 16/24 (2006.01); C23C 28/02 (2006.01); C23C 16/513 (2006.01); B32B 15/04 (2006.01); H01J 37/34 (2006.01); H01L 23/552 (2006.01); C23C 30/00 (2006.01); C23C 4/10 (2016.01); B32B 15/18 (2006.01); B32B 15/01 (2006.01); B32B 15/20 (2006.01); C23C 16/12 (2006.01); C23C 4/04 (2006.01);
U.S. Cl.
CPC ...
C23C 28/34 (2013.01); B32B 15/012 (2013.01); B32B 15/013 (2013.01); B32B 15/015 (2013.01); B32B 15/04 (2013.01); B32B 15/043 (2013.01); B32B 15/18 (2013.01); B32B 15/20 (2013.01); C23C 4/04 (2013.01); C23C 4/06 (2013.01); C23C 4/067 (2016.01); C23C 4/08 (2013.01); C23C 4/10 (2013.01); C23C 4/131 (2016.01); C23C 4/134 (2016.01); C23C 14/165 (2013.01); C23C 14/34 (2013.01); C23C 16/0281 (2013.01); C23C 16/12 (2013.01); C23C 16/24 (2013.01); C23C 16/513 (2013.01); C23C 28/023 (2013.01); C23C 28/30 (2013.01); C23C 28/32 (2013.01); C23C 28/322 (2013.01); C23C 30/00 (2013.01); C23C 30/005 (2013.01); H01J 37/32477 (2013.01); H01J 37/3411 (2013.01); H01L 23/552 (2013.01); Y10T 428/12451 (2015.01); Y10T 428/12472 (2015.01); Y10T 428/12639 (2015.01); Y10T 428/12674 (2015.01); Y10T 428/12757 (2015.01); Y10T 428/12917 (2015.01); Y10T 428/12924 (2015.01); Y10T 428/12951 (2015.01); Y10T 428/12972 (2015.01); Y10T 428/12979 (2015.01); Y10T 428/12993 (2015.01); Y10T 428/2495 (2015.01); Y10T 428/24959 (2015.01); Y10T 428/24967 (2015.01); Y10T 428/24975 (2015.01); Y10T 428/26 (2015.01); Y10T 428/263 (2015.01); Y10T 428/264 (2015.01); Y10T 428/265 (2015.01);
Abstract
A device including a hard shield material; a layer including aluminum or copper; and a silicon layer having a first thickness is disclosed. The device can also include a silicon layer having a second thickness. A method of making the device is also disclosed.