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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11485887 B1

PDFFull Text
Date of Patent:
Nov. 01, 2022

Filed:

Nov. 23, 2018

Light-fixable and heat-curing compounds based on epoxy resins and thiols

Applicant:

Delo Industrie Klebstoffe Gmbh & Co. Kgaa, Windach, DE;

Inventors:

Andreas Zillessen, Augsburg, DE;

Sabrina Roediger, Herrsching, DE;

Bastian Sueveges, Windach, DE;

Robert Born, Gilching, DE;

Assignee:

DELO INDUSTRIE KLEBSTOFFE GMBH & CO. KGAA, Windach, DE;

Attorney:

McNees Wallace & Nurick LLC

Primary Examiner:

Michael J Feely

Int. Cl.
CPC ...
C09J 163/00 (2006.01); C09D 163/00 (2006.01); C08L 63/00 (2006.01); C08G 59/66 (2006.01); C08G 59/68 (2006.01); C09D 7/61 (2018.01); C09D 7/63 (2018.01); C08G 59/18 (2006.01); C08G 59/24 (2006.01); C08K 3/36 (2006.01); C08K 5/13 (2006.01); C08K 5/43 (2006.01); C08K 13/02 (2006.01); C09J 11/04 (2006.01); C09J 11/06 (2006.01); C09K 3/10 (2006.01); C08F 222/10 (2006.01);
U.S. Cl.
CPC ...
C09J 163/00 (2013.01); C08G 59/184 (2013.01); C08G 59/245 (2013.01); C08G 59/66 (2013.01); C08K 3/36 (2013.01); C08K 5/13 (2013.01); C08K 5/43 (2013.01); C08K 13/02 (2013.01); C09D 7/61 (2018.01); C09D 7/63 (2018.01); C09D 163/00 (2013.01); C09J 11/04 (2013.01); C09J 11/06 (2013.01); C09K 3/10 (2013.01); C08F 222/102 (2020.02); C08F 222/1063 (2020.02); C09K 2200/0247 (2013.01); C09K 2200/0488 (2013.01); C09K 2200/0647 (2013.01);
Abstract

The invention relates to a composition that is liquid at room temperature, can be fixed by radiation and cured by heat, comprising the following components: (A) an at least bifunctional epoxy-containing compound; (B) an at least bifunctional thiol; (C) a radiation-curable compound; (D) a photoinitiator; (E) a stabilizer blend that contains at least one sulfonyl isocyanate and at least one acid; and (F) a nitrogen compound as an accelerator. The compositions are processable at room temperature over a period of at least 24 h and can be completely cured even at low temperatures.

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