The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 01, 2022

Filed:

Nov. 25, 2019
Applicant:

Henkel Ag & Co. Kgaa, Duesseldorf, DE;

Inventors:

Tsuyoshi Tamogami, Osaka, JP;

Yoshio Yoshida, Osaka, JP;

Tadashi Hayakawa, Osaka, JP;

Assignee:

HENKEL AG & CO., KGaA, Duesseldorf, DE;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C09J 105/00 (2006.01); C04B 26/28 (2006.01); C04B 111/00 (2006.01); C04B 111/52 (2006.01);
U.S. Cl.
CPC ...
C09J 105/00 (2013.01); C04B 26/28 (2013.01); C04B 2111/00637 (2013.01); C04B 2111/52 (2013.01);
Abstract

Disclosed is an aqueous bonding composition comprising: (A) a modified saccharide which is a product of (a) a saccharide and (b) a radical initiator. The composition further preferably comprises a structure based on (c) an amine. The composition further preferably comprises (B) an inorganic acid salt. The formaldehyde-free aqueous bonding composition can contribute to an improvement in mechanical properties such as strength and elastic modulus of a molded article, compared to a formaldehyde-containing phenol resin composition.


Find Patent Forward Citations

Tamogami, Tsuyoshi. (2022). Aqueous bonding composition (U.S. Patent No. 11485883). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11485883

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