The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 01, 2022

Filed:

Jun. 06, 2019
Applicant:

Robert Bosch Gmbh, Stuttgart, DE;

Inventors:

Jan Waldmann, Reutlingen, DE;

Rolf Scheben, Reutlingen, DE;

Rudy Eid, Stuttgart, DE;

Assignee:

Robert Bosch GmbH, Stuttgart, DE;

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01P 1/02 (2006.01); B81B 3/00 (2006.01); G01P 1/00 (2006.01); G01P 3/44 (2006.01); G01P 15/125 (2006.01); G01P 15/08 (2006.01);
U.S. Cl.
CPC ...
B81B 3/0081 (2013.01); G01P 1/006 (2013.01); G01P 1/023 (2013.01); G01P 3/44 (2013.01); G01P 15/125 (2013.01); B81B 2201/0235 (2013.01); B81B 2201/0264 (2013.01); B81B 2203/0315 (2013.01); G01P 2015/0871 (2013.01);
Abstract

A micromechanical sensor. The sensor includes a substrate, a cap element situated on the substrate, at least one seismic mass that is deflectable orthogonal to the cap element, an internal pressure that is lower by a defined amount relative to the surrounding environment prevailing inside a cavity, and a compensating element designed to provide a homogenization of a temperature gradient field in the cavity during operation of the micromechanical sensor.


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