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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11485067 B1

PDFFull Text
Date of Patent:
Nov. 01, 2022

Filed:

Jul. 27, 2016

Resin composition for modeling material, resin composition for supporting material, photofabrication product, and process for producing photofabrication product

Applicants:

Maxell, Ltd., Kyoto, JP;

Mimaki Engineering Co., Ltd., Tomi, JP;

Inventors:

Katsuyuki Kitou, Osaka, JP;

Taeko Izumo, Osaka, JP;

Assignees:

MAXELL, LTD., Kyoto, JP;

MIMAKI ENGINEERING CO., LTD., Nagano, JP;

Attorney:

McDermott Will & Emery LLP

Primary Examiner:

Michael F Pepitone

Int. Cl.
CPC ...
B29C 64/112 (2017.01); B33Y 70/00 (2020.01); C08F 290/06 (2006.01); B29C 67/00 (2017.01); C08L 33/24 (2006.01); B29C 64/264 (2017.01); B29C 64/245 (2017.01); B29C 64/268 (2017.01); C08L 33/08 (2006.01); C08L 33/10 (2006.01); C08L 71/02 (2006.01); C08L 75/06 (2006.01); B33Y 10/00 (2015.01); B33Y 80/00 (2015.01);
U.S. Cl.
CPC ...
B29C 64/112 (2017.08); B29C 64/245 (2017.08); B29C 64/264 (2017.08); B29C 64/268 (2017.08); B29C 67/00 (2013.01); B33Y 70/00 (2014.12); C08F 290/06 (2013.01); C08L 33/08 (2013.01); C08L 33/10 (2013.01); C08L 33/24 (2013.01); C08L 71/02 (2013.01); C08L 75/06 (2013.01); B33Y 10/00 (2014.12); B33Y 80/00 (2014.12); C08L 2205/03 (2013.01);
Abstract

A resin composition for a modeling material for use in shaping a modeling material () by an ink-jet photofabrication method, the resin composition comprising, based on 100 parts by weight of the whole resin composition, 19 to 49 parts by weight of a water-insoluble monofunctional ethylenically unsaturated monomer (A), 15 to 50 parts by weight of a di- or more-functional polyfunctional ethylenically unsaturated monomer (B), 10 to 45 parts by weight of an oligomer (C), and a photopolymerization initiator (D). By this resin composition for a modeling material, a photofabrication product having good dimensional accuracy can be obtained.

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