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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11485043 B1

PDFFull Text
Date of Patent:
Nov. 01, 2022

Filed:

Jan. 17, 2018

Additive manufacturing apparatus utilizing combined electron beam selective melting and electron beam cutting

Applicant:

Tsinghua University, Beijing, CN;

Inventors:

Feng Lin, Beijing, CN;

Bin Zhou, Beijing, CN;

Wentao Yan, Beijing, CN;

Hongxin Li, Beijing, CN;

Lei Zhang, Beijing, CN;

Ting Zhang, Beijing, CN;

Chao Guo, Beijing, CN;

Assignee:

TSINGHUA UNIVERSITY, Beijing, CN;

Attorney:

Hodgson Russ LLP

Primary Examiner:

John J Norton

Assistant Examiner:

Simpson A Chen

Int. Cl.
CPC ...
B28B 1/00 (2006.01); B33Y 30/00 (2015.01); B33Y 50/02 (2015.01); B33Y 40/20 (2020.01); B23K 15/00 (2006.01); B23K 15/06 (2006.01); B23K 15/08 (2006.01); B22F 10/20 (2021.01); B22F 10/32 (2021.01); B22F 10/36 (2021.01); B22F 10/00 (2021.01); B22F 12/45 (2021.01); B22F 10/28 (2021.01); B22F 12/50 (2021.01); B33Y 10/00 (2015.01); H01J 37/04 (2006.01); B22F 10/30 (2021.01);
U.S. Cl.
CPC ...
B28B 1/001 (2013.01); B22F 10/00 (2021.01); B22F 10/20 (2021.01); B22F 10/28 (2021.01); B22F 10/32 (2021.01); B22F 10/36 (2021.01); B22F 12/45 (2021.01); B22F 12/50 (2021.01); B23K 15/002 (2013.01); B23K 15/004 (2013.01); B23K 15/0013 (2013.01); B23K 15/0033 (2013.01); B23K 15/0086 (2013.01); B23K 15/06 (2013.01); B23K 15/08 (2013.01); B33Y 10/00 (2014.12); B33Y 30/00 (2014.12); B33Y 40/20 (2020.01); B33Y 50/02 (2014.12); H01J 37/04 (2013.01); B22F 10/30 (2021.01);
Abstract

An additive manufacturing apparatus utilizing combined electron beam selective melting and electron beam cutting. One electron beam emitting, focusing, and scanning device (6) is capable of emitting electron beams (67, 68) in three modes of heating, selective melting, and electron beam cutting. The electron beam in the heating mode is emitted to scan and preheat a powder bed (7). The electron beam (67) in the selective melting mode is emitted to scan and melt powder (71) in a section outline to form a section layer of a component. The electron beam (68) in the electron beam cutting mode is emitted to perform one or more cutting scans on inner and outer outlines (74, 75) of a section of the component to obtain accurate and smooth inner and outer outlines of the section. The heating, melting deposition, and outline cutting processes are repeated to obtain a required three-dimensional physical component.

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