The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 01, 2022

Filed:

Jul. 11, 2017
Applicant:

Posco, Pohang-si, KR;

Inventors:

Hyeong-Jun Huh, Gwangyang-si, KR;

Choong-Soo Lim, Gwangyang-si, KR;

Sung-Joon Kwak, Gwangyang-si, KR;

Assignee:

POSCO, Pohang-si, KR;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B21B 45/00 (2006.01); B21B 15/00 (2006.01); B23D 19/04 (2006.01);
U.S. Cl.
CPC ...
B21B 45/008 (2013.01); B21B 15/00 (2013.01); B21B 15/0007 (2013.01); B21B 45/004 (2013.01); B23D 19/04 (2013.01); B21B 2015/0021 (2013.01); B21B 2203/12 (2013.01);
Abstract

The present invention provides an apparatus for cutting a material, comprising: a frame body installed on a conveying path of a material; a cutting means, mounted on the frame body, for cutting an end portion of the material being conveyed; a laser preheating means for preheating the material by irradiating a laser beam onto the material before being conveyed to the cutting means; and a blocking and reflection means for blocking the laser beams reflected to the cutting means and re-reflecting the laser beam to the material.


Find Patent Forward Citations

Huh, Hyeong-Jun. (2022). Apparatus for cutting material and system for cutting material (U.S. Patent No. 11484925). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11484925

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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