The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 25, 2022
Filed:
Dec. 18, 2020
California Institute of Technology, Pasadena, CA (US);
Adrian J. Tang, Pasadena, CA (US);
Mau-Chung Frank Chang, Los Angeles, CA (US);
Rulin Huang, Los Angeles, CA (US);
CALIFORNIA INSTITUTE OF TECHNOLOGY, Pasadena, CA (US);
THE REGENTS OF THE UNIVERSITY OF CALIFORNIA, Oakland, CA (US);
Abstract
We have demonstrated that the bandwidth millimeter wavelengths offer can be leveraged to deeply spread a low-data rate signal below the thermal floor of the environment (sub-thermal) by lowered transmit power combined with free space losses, while still being successfully received through a novel dispreading structure which does not rely on pre-detection to extract timing information. The demonstrated data link ensures that it cannot be detected beyond a designed range from the transmitter, while still providing reliable communication. A demonstration chipset of this sub-thermal concept was implemented in a 28 nm CMOS technology and when combined with an InP receiver was shown to decode signals up to 30 dB below the thermal noise floor by spreading a 9600 bps signal over 1 GHz of RF bandwidth from 93 to 94 GHz using a 64 bit spreading code. The transmitter for this chipset consumed 62 mW while the receiver consumed 281 mw.