The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 25, 2022

Filed:

May. 28, 2021
Applicant:

Cisco Technology, Inc., San Jose, CA (US);

Inventors:

Jason Visneski, San Jose, CA (US);

George Edward Curtis, San Jose, CA (US);

Mike Sapozhnikov, San Jose, CA (US);

Peter Gunadisastra, Palo Alto, CA (US);

Joel Goergen, Soulsbyville, CA (US);

Assignee:

CISCO TECHNOLOGY, INC., San Jose, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/11 (2006.01); H05K 3/34 (2006.01); H01R 12/53 (2011.01); H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
H01R 12/53 (2013.01); H05K 1/114 (2013.01); H05K 1/181 (2013.01); H05K 3/3436 (2013.01); H05K 2201/09545 (2013.01); H05K 2201/09827 (2013.01); H05K 2201/09854 (2013.01); H05K 2201/10303 (2013.01); H05K 2201/10356 (2013.01); H05K 2201/10734 (2013.01);
Abstract

An apparatus includes a printed circuit board (PCB). The PCB includes a plurality of through-holes extending through the PCB between a PCB first surface and a PCB second surface that opposes the PCB first surface, where each through-hole includes a via extending from the PCB first surface to a depth within the through-hole that is distanced from the PCB second surface. An integrated circuit surface mount is connected at the PCB first surface with vias of the through-holes, and a cable interconnect assembly is surface mount connected at the PCB second surface. The cable interconnect assembly includes a plurality of contact pins, each contact pin extending within a corresponding through-hole and having a sufficient dimension to engage and electrically connect with the via of the corresponding through-hole so as to facilitate exchange of an electrical signal between the integrated circuit and the cable interconnect assembly.


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