The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 25, 2022

Filed:

Feb. 01, 2021
Applicant:

Viasat, Inc., Carlsbad, CA (US);

Inventors:

Maria Carolina Vigano, Lausanne, CH;

Kenneth V. Buer, Gilbert, AZ (US);

Douglas J. Mathews, Mesa, AZ (US);

Assignee:

VIASAT, INC., Carlsbad, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01Q 21/00 (2006.01); H01Q 3/26 (2006.01); H01Q 1/22 (2006.01); H01Q 3/40 (2006.01); H01Q 21/06 (2006.01); H01Q 1/38 (2006.01);
U.S. Cl.
CPC ...
H01Q 21/0025 (2013.01); H01Q 1/2283 (2013.01); H01Q 3/2658 (2013.01); H01Q 3/40 (2013.01); H01Q 21/0087 (2013.01); H01Q 21/0093 (2013.01); H01Q 1/38 (2013.01); H01Q 21/065 (2013.01);
Abstract

A phased array antenna includes an array of antenna element modules. Each of the array of antenna element modules includes a dielectric substrate having a lower surface and a radiating element. Each of the antenna element modules also includes an integrated circuit (IC) chip adhered to the lower surface of the dielectric substrate. The IC chip includes a circuit to adjust a signal communicated with the radiating element. The phased array antenna also includes a multi-layer substrate underlying the array of antenna element modules, the multi-layer substrate including a beam forming network (BFN) circuit formed on a layer of the multi-layer substrate and the BFN circuit is in electrical communication with the IC chip of each of the array of antenna element modules.


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