The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 25, 2022

Filed:

Jan. 12, 2021
Applicant:

Infineon Technologies Ag, Neubiberg, DE;

Inventors:

Thomas Lampersberger, Linz, AT;

Reinhard Feger, Linz, AT;

Markus Josef Lang, Pfarrkirchen, AT;

Juergen Minichshofer, Linz, AT;

Ernst Seler, Munich, DE;

Andreas Stelzer, Linz, AT;

Assignee:

Infineon Technologies AG, Neubiberg, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01Q 1/22 (2006.01); H01Q 21/00 (2006.01); H01Q 9/04 (2006.01); H01Q 5/371 (2015.01);
U.S. Cl.
CPC ...
H01Q 1/2283 (2013.01); H01Q 5/371 (2015.01); H01Q 9/0414 (2013.01); H01Q 21/0037 (2013.01);
Abstract

A radio-frequency device comprises a semiconductor package, which comprises a radio-frequency chip and a radio-frequency antenna. The semiconductor package is designed to be mechanically and electrically connected to a circuit board via at least one connecting element of the semiconductor package, with one surface of the semiconductor package facing the circuit board. The radio-frequency device also comprises a waveguide structure oriented in a direction parallel to the surface of the semiconductor package, the radio-frequency antenna being designed for at least one of the following: to emit radiation into the waveguide structure in the direction parallel to the surface of the semiconductor package, or to receive signals via the waveguide structure in the direction parallel to the surface of the semiconductor package.


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