The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 25, 2022

Filed:

Jun. 21, 2018
Applicant:

Koninklijke Philips N.v., Eindhoven, NL;

Inventors:

Marius Iosif Boamfa, Veldhoven, NL;

Franciscus Antonius Kneepkens, Waarle, NL;

Bastiaan Wilhelmus Maria Moeskops, Uden, NL;

Rieko Verhagen, Vught, NL;

Jonathan Alambra Palero, Noord-Brabant, NL;

Frank Anton Van Abeelen, Eindhoven, NL;

Assignee:

KONINKLIJKE PHILIPS N.V., Eindhoven, NL;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/075 (2006.01); H01L 33/00 (2010.01); H01L 33/62 (2010.01);
U.S. Cl.
CPC ...
H01L 25/0753 (2013.01); H01L 33/005 (2013.01); H01L 33/62 (2013.01); H01L 2933/0066 (2013.01);
Abstract

There is provided an apparatus comprising: a base substrate and a component substrate having at least two electronic components arranged thereon. At least one aperture is formed through an entire thickness of the component substrate. The at least one aperture is formed in an interspace between the at least two electronic components. The component substrate is coupled to the base substrate using a solder joint. Each of the at least two electronic components may comprise a light emitting diode element. A method of manufacturing an apparatus is also disclosed.


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