The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 25, 2022
Filed:
Jul. 26, 2019
Hitachi Automotive Systems, Ltd., Hitachinaka, JP;
Akira Matsushita, Hitachinaka, JP;
Takahiro Shimura, Hitachinaka, JP;
Yusuke Takagi, Hitachinaka, JP;
Hitachi Astemo, Ltd., Hitachinaka, JP;
Abstract
An object of the present invention is to provide a power semiconductor device capable of improving seismic resistance while suppressing a decrease in assembly efficiency. According to the present invention, a power semiconductor deviceincludes an element installation conductorincluding a first conductor portionthat is made of metal and is used for installing a power semiconductor element, a second conductor portionthat is made of metal and forms one or more main terminalsfor transmitting a current to the power semiconductor element, and one or more control terminalsfor transmitting a switching control signal to the power semiconductor element, and a third conductor portionthat is made of metal and is provided at a tip portion of the control terminal. In the power semiconductor device, the element installation conductoris formed so that the thickness of the thickest portion of the second conductor portionis thinner than the thickness of the first conductor portion, and the thickness of the thickest portion of the third conductor portionis thinner than the thickness of the thinnest portion of the second conductor portion