The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 25, 2022

Filed:

Nov. 04, 2020
Applicant:

Taiyo Yuden Co., Ltd., Tokyo, JP;

Inventors:

Mikio Tahara, Tokyo, JP;

Tomoaki Nakamura, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01G 4/248 (2006.01); H01G 4/30 (2006.01); H01G 4/12 (2006.01); H01G 4/012 (2006.01); H01G 13/00 (2013.01); H01G 4/232 (2006.01);
U.S. Cl.
CPC ...
H01G 4/248 (2013.01); H01G 4/012 (2013.01); H01G 4/12 (2013.01); H01G 4/232 (2013.01); H01G 4/30 (2013.01); H01G 13/00 (2013.01);
Abstract

A ceramic electronic component includes a multilayer chip including a multilayer structure and cover layers disposed on top and bottom faces in a stack direction of the multilayer structure, and a pair of external electrodes respectively formed on two edge faces of the multilayer structure and extending to four side faces of the multilayer chip, wherein each external electrode has a recessed portion on at least one of two side faces facing each other in the stack direction or at least one of remaining two side faces, and wherein each external electrode has no recessed portion on the two side faces when each external electrode has the recessed portion on at least one of the remaining two side faces, and has no recessed portion on the remaining two side faces when each external electrode has the recessed portion on at least one of the two side faces.


Find Patent Forward Citations

Loading…