The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 25, 2022

Filed:

Aug. 29, 2020
Applicant:

Amatech Group Limited, Spiddal, IE;

Inventors:

Mustafa Lotya, Celbridge, IE;

David Finn, Tourmakeady, IE;

Darren Molloy, Headford, IE;

Assignee:

AmaTech Group Limited, Galway, IE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06K 19/06 (2006.01); G06K 19/077 (2006.01); H01Q 1/22 (2006.01); H01Q 21/29 (2006.01); H01Q 7/00 (2006.01); H05K 1/16 (2006.01); H01F 27/28 (2006.01); H05K 3/10 (2006.01); H01F 38/14 (2006.01);
U.S. Cl.
CPC ...
G06K 19/07794 (2013.01); G06K 19/07769 (2013.01); G06K 19/07783 (2013.01); H01Q 1/2216 (2013.01); H01Q 1/2225 (2013.01); H01Q 1/2283 (2013.01); H01Q 7/00 (2013.01); H01Q 21/29 (2013.01); H05K 1/165 (2013.01); H01F 27/2804 (2013.01); H01F 38/14 (2013.01); H05K 3/103 (2013.01); H05K 2201/10098 (2013.01); Y10T 29/49018 (2015.01); Y10T 29/49162 (2015.01);
Abstract

Smartcards with metal layers manufactured according to various techniques disclosed herein. One or more metal layers of a smartcard stackup may be provided with slits overlapping at least a portion of a module antenna in an associated transponder chip module disposed in the smartcard so that the metal layer functions as a coupling frame. One or more metal layers may be pre-laminated with plastic layers to form a metal core or clad subassembly for a smartcard, and outer printed and/or overlay plastic layers may be laminated to the front and/or back of the metal core. Front and back overlays may be provided. Various constructions of and manufacturing techniques (including temperature, time, and pressure regimes for laminating) for smartcards are disclosed herein.


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